http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201519706-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D4-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-101 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 |
| filingDate | 2014-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e33a316a6eca999c0ea8ac6b4e1489a6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5ba8b0e15b6dd093f31cda4fd552ae9f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_86262cbb7ac4ddf4f22513d7743c1eb7 |
| publicationDate | 2015-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201519706-A |
| titleOfInvention | Hardened composition for printed wiring board, hardened coating film and printed wiring board using the same |
| abstract | An object of the present invention is to provide a printed wiring board, particularly a cured composition capable of simultaneously obtaining good adhesion and high hardness, a photoresist coating film, and a photoresist pattern having a photoresist pattern. Wiring board.nThe solution is to obtain a hardened composition for a printed wiring board, which comprises (A) a compound having a triazine ring, (B) a (meth) acrylate compound having a hydroxyl group, and (C) photopolymerization. a starting agent; a coating film obtained by hardening the light, and a printed wiring board having a photoresist pattern. |
| priorityDate | 2013-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 237.