http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201519300-A

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filingDate 2013-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2015-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201519300-A
titleOfInvention Semiconductor process
abstract The present invention relates to a semiconductor process comprising the steps of: (a) providing a semiconductor component; (b) attaching the semiconductor component to a carrier via an adhesive layer such that the adhesive layer is interposed between the semiconductor component and And (c) cutting the semiconductor element to form a plurality of semiconductor element monomers. Thereby, the gaps between the semiconductor element units are fixed after cutting, and it is convenient to test the semiconductor element monomers.
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Total number of triples: 31.