| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_97e705fa0022c85763b090ae72c31ec2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G8-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1006 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-04 |
| filingDate |
2014-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a1dc20cbb0104bb0194b7f537458556
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ac256a08b34d1008597b6a9371e31bfa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_83cecbf1acbb03dca9791febb7f31f00 |
| publicationDate |
2015-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201518394-A |
| titleOfInvention |
Epoxy resin composition, encapsulating material, cured product thereof and phenol resin |
| abstract |
The epoxy resin composition of the present invention is characterized in that it contains at least an epoxy resin and a phenol resin represented by a specific chemical formula (1). The epoxy resin composition preferably further contains an inorganic filler. Further, it is also preferred that the blending ratio of the inorganic filler in the epoxy resin composition [the mass of the inorganic filler/the mass of the epoxy resin composition containing the inorganic filler] is 70 to 95% by mass. Further, it is also preferred to contain a solvent, and the epoxy resin and the phenol resin are uniformly dissolved in the solvent. |
| priorityDate |
2013-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |