| abstract |
The present invention provides a conductive paste composition for forming a backside solder pad on a solar cell, the composition comprising metal particles; a glass frit comprising at least one of Bi2O3, Al2O3, SiO2, B2O3, and Li2O or Li3PO4; and an organic medium Agent. The present invention also provides a solar cell comprising a front and back germanium wafer, and a solder pad fabricated from the conductive paste according to the present invention formed on the germanium wafer. The invention further provides a solar cell module comprising electrically interconnected solar cells according to the invention. There is also provided a method of fabricating a solar cell, the method comprising the steps of: providing a front and back germanium wafer; applying a conductive paste composition according to the present invention to a back side of the germanium wafer, and The wafer is fired. |