| abstract |
An inorganic filler coated with a molybdenum compound, suitable for use in a laminate or prepreg, and for manufacturing a printed circuit board having a low coefficient of thermal expansion, and the amount of addition can be increased to the total weight of the resin composition of the laminate or the prepreg. 20~80wt% will not affect the drilling processability, hole position accuracy and solder heat resistance of printed circuit boards. |