http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201513741-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2fb022c0d4aab8942866848ff5970cff |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 |
| filingDate | 2013-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e4fa5ab26879c24b6296958ca0d39b0b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5e3e8199740212579e6e9e1fb7293971 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_359a21831e614a23e74f2db5cfc97e52 |
| publicationDate | 2015-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201513741-A |
| titleOfInvention | Printed circuit board and manufacturing method thereof |
| abstract | A method of manufacturing a printed circuit board, comprising: providing a wire layer; forming an insulating layer comprising glass fibers on the wire layer; forming an opening in the insulating layer including the glass fiber, wherein the glass fiber protrudes from the sidewall of the opening, And leaving a residue of the insulating layer in the opening; performing a desmear process to remove the residue of the insulating layer in the opening; performing an etching process to remove the portion of the glass fiber protrusion on the sidewall of the opening; The opening is filled with a conductive material to form a conductive blind hole. |
| priorityDate | 2013-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 26.