http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201513267-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_31da94917d1067c89f7e22444c88a836 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate | 2013-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8ac717033b4be35b0526123e44e9c324 |
| publicationDate | 2015-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201513267-A |
| titleOfInvention | On-site vapor deposition method as self-assembled monolayer of copper adhesion promoter and diffusion barrier layer |
| abstract | The present invention relates to a self-assembled monolayer vapor deposition method as a copper adhesion promoter and diffusion barrier layer. A copper region is formed in the dielectric layer. A diffusion barrier layer comprising a self-assembled monolayer is deposited over the copper region. The cover layer is deposited over the self-assembled monolayer. In some embodiments, the cover layer and the self-assembled monolayer are deposited in the same processing chamber. |
| priorityDate | 2013-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 38.