http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201512467-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_781c429e4e20536916ff74dcbe1b5417 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| filingDate | 2014-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cc956791e10dbbfebd72c1da10b98d3f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f2ba2d20706b9dcfa967c9141f229929 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f9ef2de8b4a88550e85493ca4e7b7add http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_66dd8c9ab93194ac37aa952d6d8ca690 |
| publicationDate | 2015-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201512467-A |
| titleOfInvention | Copper foil for high-frequency circuit, copper-clad laminate for high-frequency circuit, printed wiring board for high-frequency circuit, copper foil with high-frequency circuit, electronic device, and manufacturing method of printed wiring board |
| abstract | The present invention provides a copper foil for high-frequency circuits which can satisfactorily suppress transmission loss even when used for a high-frequency circuit board, and can suppress the occurrence of powder falling on the surface of the copper foil. The copper foil for high-frequency circuit of the present invention is formed by forming a primary particle layer of copper on the surface of the copper foil, and then forming a secondary particle layer of a ternary alloy composed of copper, cobalt and nickel on the primary particle layer. The ratio of the three-dimensional surface area obtained by a laser microscope to a two-dimensional surface area of a certain area of the roughened surface of the copper foil was 2.0 or more and less than 2.2. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I707070-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11401612-B2 |
| priorityDate | 2013-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 65.