http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201510273-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_de498babb0c04a00ceb653738877b147 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-08 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-08 |
| filingDate | 2014-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c1f2c0f57db2e2b64e14080ff965257d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bfdbb12ab2ec2953b49b945250721214 |
| publicationDate | 2015-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201510273-A |
| titleOfInvention | Composition for forming copper film and method for producing copper film using same |
| abstract | The present invention relates to a copper film-forming composition comprising: copper formate of 0.1 to 3.0 mol/kg or a hydrate thereof, a diol compound represented by the following general formula (1), and the following general formula (2) The piperidine compound represented by the formula, and when the content of copper formate or its hydrate is 1 mol/kg, the diol compound is contained in the range of 0.1 to 6.0 mol/kg, and is 0.1 to 6.0 mol. The range of ears/kg contains a piperidine compound. The present invention is a solution for forming a copper film which does not contain a solid phase such as fine particles, and can be applied to a substrate and heated at less than 200 ° C to obtain a copper film having sufficient conductivity.n□ |
| priorityDate | 2013-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 229.