| abstract |
The present invention relates to a thermosetting resin composition, an insulating film using the same, an insulating film with a support, a laminate, and a printed wiring board, the thermosetting resin composition comprising: at least one molecule Two N-substituted maleimide-based maleimide compounds (a), which are produced by reacting an amine compound (b) having at least two primary amine groups in one molecule in an organic solvent The unsaturated maleimide-based resin composition (A); the thermosetting resin (B); and the isocyanate masking imidazole compound (C) such as imidazole or epoxy-masked imidazole. |