| titleOfInvention |
a phenolic hydroxy compound, a photosensitive composition, a resist composition, a resist coating film, a curable composition, a cured product, a resist underlayer film composition, and a resist underlayer film |
| abstract |
The present invention provides a composition for a resist underlayer containing a phenolic hydroxy compound, which is excellent in heat resistance, thermal decomposition resistance, light sensitivity, and resolution, and a composition for a resist underlayer film which is excellent in thermal decomposition resistance and dry etching resistance. . The phenolic hydroxy compound of the present invention is characterized by having a molecular structure represented by the following structural formula (1).n□ (wherein R1 is a hydrogen atom, an alkyl group or an aryl group, and n is an integer of 2 to 10; R2nm is an integer of 0 to 4, and in the case where m is 2 or more, a plurality of R2's may be the same or different, and may also be an alkyl group, an alkoxy group, an aryl group, an arylalkyl group or a halogen atom. It may be bonded to any of the two aromatic rings of the naphthyl skeleton. ) |