http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201508029-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-548 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L71-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2014-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b28cd3055070180893e77f09fa400a8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_88cf43b812972e1ee5bce076f865ce6b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2e60b940ec6f10c400773ec8172f499d |
| publicationDate | 2015-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201508029-A |
| titleOfInvention | Resin composition for semiconductor encapsulation, semiconductor device having cured product thereof, and method of manufacturing semiconductor device |
| abstract | An object of the present invention is to provide a resin composition which can be formed to have a low thermal decomposition (weight reduction) even at a high temperature of 200 ° C or higher, for example, a high temperature of 200 ° C to 250 ° C, and with CuLF or Ag plating. A cured product which is excellent in adhesion and has excellent mechanical strength at high temperatures and is excellent in reliability. The present invention provides a composition comprising: (A) a cyanate ester compound having two or more cyanooxy groups in one molecule, (B) a phenol compound represented by the formula (2), and (C) inorganic The molar ratio of the phenolic hydroxyl group in the (B) phenol compound to the cyanooxy group in the (A) cyanate compound is 0.1 to 0.4. |
| priorityDate | 2013-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 146.