http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201505509-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c999fee6428152a996011d506925c2d7 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4655 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4626 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 2014-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9a633fd9616df953cb80d71f5b70943b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3cd211457d06b5eb48ba77b9d06b22f7 |
| publicationDate | 2015-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201505509-A |
| titleOfInvention | Method for manufacturing multilayer printed wiring board and composite material thereof using prepreg containing carrier metal foil |
| abstract | A method for producing a multilayer printed wiring board, comprising the steps of (A) to (D): (A) preparing a laminate having a support/prepreg/copper alloy plating layer/carrier metal foil a step of laminating a composite metal foil prepreg, (B) stripping the support of the composite material containing the prepreg with a carrier metal foil, and laminating the prepreg on the inner layer circuit substrate (C) a step of hardening the prepreg to form an insulating layer, and (D) a step of peeling off the carrier metal foil. |
| priorityDate | 2013-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 128.