http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201505087-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0543b7dcc7c8cd8091e1f977762f3712 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30608 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G05B19-418 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67075 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4835 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31111 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67017 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32134 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02019 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6708 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306 |
| filingDate | 2014-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d3e3278093cec828b99ae525ff2d4c30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_411c7142496c7848ae40c5d910adceb2 |
| publicationDate | 2015-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201505087-A |
| titleOfInvention | Processing system and method for providing heated etching solution |
| abstract | The present invention provides a method and processing system for independent temperature and hydration control of an etching solution for processing a wafer in a processing chamber. The method comprises the steps of: circulating an etching solution in a circulation loop; maintaining the etching solution at a hydration set point by adding water to the etching solution or removing water from the etching solution; maintaining the etching solution at a temperature set point, the temperature The set point is lower than the boiling point of the etching solution in the recycle loop; and the etching solution is dispensed into the processing chamber for processing the wafer. In one embodiment, the dispensing step includes: dispensing an etching solution into a processing region in the processing chamber adjacent to the wafer; introducing steam into an outer region of the processing chamber away from the wafer; and etching the solution and steam To process the wafer. |
| priorityDate | 2013-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 26.