| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f56b5174f7d196258707ccf1d609796e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67138
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6776
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67173
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76802
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76801
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76807
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B65G35-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02074
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67259
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67219
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67051
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67046 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
2014-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c9425213605039bb854267bbf14fabbd |
| publicationDate |
2015-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201503285-A |
| titleOfInvention |
Semiconductor device manufacturing method and semiconductor manufacturing device |
| abstract |
It is to suppress the occurrence of defects caused by light corrosion in the semiconductor device.nThe method for manufacturing a semiconductor device includes: an insulating layer forming process for forming an insulating layer having a concave portion on a substrate (SUB); and a conductive film forming process for forming a conductive film in the concave portion and the insulating layer; It is removed by polishing a conductive film on the insulating layer; and a cleaning process is performed to clean the insulating layer in a light-shielded state.nAfter the polishing process and the cleaning process, or after the cleaning process, the presence or absence of the substrate (SUB) in the light-shielding state is detected by the infrared sensor (SNS1), and the substrate (SUB) is moved. |
| priorityDate |
2013-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |