http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201502706-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24802 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 |
| filingDate | 2014-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b86ef6ec3e063419c2148acd39ffd2e7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4f89a4af39dd9dacc3355fd95ae0168a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f9c49d946892eaf7ca25e9511840d47f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_62ee4ba07b89c383cb1296f9bb7dfc46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97eda3b68efb8b05786fc55e6b612a18 |
| publicationDate | 2015-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201502706-A |
| titleOfInvention | Curable resin composition, cured product thereof, printed wiring board having the cured product, and method for producing cured product |
| abstract | An object of the present invention is to provide an alkali-developable curable resin composition excellent in strength and toughness against tearing, cracking, deformation, and torsion, a cured product thereof, a printed wiring board having the cured product, and a cured product. Production method.nThe solution of the present invention is a curable resin composition, a cured product thereof, a printed wiring board having the cured product, and a method for producing a cured product, the curable resin composition comprising: (A) a thermoplastic resin, ( B) a curable resin composition of at least one of a thermosetting component, (C) an alkali-soluble component, and (D-1) a photopolymerization initiator and (D-2) a photobase generator, which is characterized by the aforementioned The thermoplastic resin (A) has two or more glass transition points, and two of the glass transition points Tgx and Tgy are Tgx>30° C., Tgy<0° C., and the aforementioned thermosetting component (B) has a glass transition point Tgz, And Tgz≧Tgy+20 °C. |
| priorityDate | 2013-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 251.