| abstract |
To implement a single-chip ultrasonic imaging solution, signal processing on the wafer can be employed in the receive signal path to reduce data bandwidth, and a high-speed serial data module can be used for all off-chip reception. The channel to which the data is moved is used as a stream of digital data. The digitization on the wafer of received signals allows advanced digital signal processing to be performed on the wafer and thus allows an entire ultrasonic imaging system to be fully integrated on a single semiconductor substrate. Various novel waveform generation techniques, transducer configuration settings, and biasing methods are also disclosed. The HIFU method can be additionally or alternatively employed as a component of the "ultrasonic single wafer" solution disclosed herein. |