| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-131
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68377
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68368
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83862
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2461-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2405-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2463-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68386
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73104
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29387
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2333-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2333-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81801
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2270-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-271
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-27003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2929
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-27
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-92
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00 |
| filingDate |
2014-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_feb5c46e949ffc8c3c8a53b81339ab0a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_334f81717612b72a029585c5e5a9896e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0bd21255082f9018fc327429cc5f9c02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_837f51ca2d7606e381069127d94ef66d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d558f51235128c0066525fc05b80de3d |
| publicationDate |
2015-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201502228-A |
| titleOfInvention |
Method for producing a semiconductor device, sheet-like resin composition, and dicing tape-integrated sheet-like resin composition |
| abstract |
An object of the present invention is to provide a method of manufacturing a semiconductor device capable of suppressing adhesion to a wafer with an attached support when the support is peeled off from a wafer with a support having a temporary fixed layer bonded to a support and a support. The sheet-like resin composition on the other side is dissolved. A method of manufacturing a semiconductor device according to the present invention includes a step A of preparing a wafer with an auxiliary support to which a support is bonded via a temporary fixing layer on one surface of a wafer on which a through electrode is formed; and step B, which is prepared for dicing a diced tape-integrated sheet-like resin composition having a sheet-like resin composition having a smaller outer shape than the other side of the wafer; and step C, attaching the other side of the wafer with the support to the dicing tape a sheet-like resin composition of the body-shaped sheet-like resin composition; and a step D of dissolving the temporary fixing layer by a solvent to peel the support from the wafer. |
| priorityDate |
2013-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |