http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201501900-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_df9c393a770b8892e50718d2b4df2e5d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C33-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 |
| filingDate | 2014-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9daa0809804415dfaaf4952587b2c0e3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_15dca0e03ef4d87e172ff18ce7e288e1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f1cc9c37758203808a10aaaf8786baa4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_74467e2a0b82c83a1a9e0acca8e95ebf http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_81f0b390670c74245b19db49b65cdecc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1935168f2963898907963223207bcb31 |
| publicationDate | 2015-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201501900-A |
| titleOfInvention | Mold release sheet |
| abstract | Conventionally, the blast-treated release sheet has a problem in that the granules remaining on the surface of the substrate generated by the manufacturing step at the time of blasting contact the lead frame and hinder the sealing of the lead resin to the lead frame, thereby generating The leakage of the resin of the mold resin causes a problem that the yield of the product of the semiconductor device is deteriorated. Accordingly, an object of the present invention is to provide a release sheet which does not hinder the sealing of the lead resin to the lead frame, and prevents the low molecular weight component derived from the release sheet substrate from adhering to the mold, and the resin of the mold resin is not leaked. The mold can be formed into a semiconductor device. The release sheet of the present invention has a concavo-convex layer containing a fine particle, a substrate, and a resin layer. The content of the fine particles is preferably from 10 to 85% by mass based on the total mass of the uneven layer, and the surface roughness Ra of the uneven layer is preferably 0.2 μm ≦ Ra ≦ 2.5 μm. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I716540-B |
| priorityDate | 2013-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 99.