| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8cf8d77ac0eff1767b22d2fb9445b64d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-4973
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23B2226-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23P6-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23P25-006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T82-10 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23B27-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23B5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-4404
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32467
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23B1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B28D1-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23P6-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-564 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B28D1-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-54 |
| filingDate |
2014-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0495392dcd97f8a9a1dc9e861f341603
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b69b2bdfe3ab08d0d9ab64b58ec6374a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_582ba9f2c6c9fc025cb6af65f90acb7d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a560a99117c1913b7f758d12f6605c5a |
| publicationDate |
2015-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201501896-A |
| titleOfInvention |
Toughness mode processing method for hard and brittle components of plasma processing equipment |
| abstract |
Disclosed herein is a toughness mode processing method for a plasma processing equipment component, wherein the component is made of a non-metallic, hard brittle material. The method comprises: turning the component by a single point using a diamond cutting tool such that a portion of the non-metallic hard brittle material undergoes a high pressure phase change during chip formation to form a tough phase portion of the hard brittle material, wherein the turned surface is warped The phase change material is formed and the warp surface is the groove textured surface of the phase change material. |
| priorityDate |
2013-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |