http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201501175-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0b0b875cbbdd4a39c2418462c42af5ab http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_180f35d895aa83f0157103026156988e |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C33-424 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C33-64 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 |
| filingDate | 2013-06-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8238bb278e14603bd0d082c6e04cceb9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d796f3d3c75f12e89b2904ee2849ff4e |
| publicationDate | 2015-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201501175-A |
| titleOfInvention | Method of strengthening semiconductor manufacturing tools |
| abstract | The invention is a method for strengthening a semiconductor manufacturing tool, comprising the steps of: providing a mold core, forming a primary oxide layer, attaching a release agent, and forming a glass bond release layer, and the strong glass bond formation formed by the above steps The layer is evenly distributed on the surface of the mold, so that the mold of the semiconductor manufacturing tool can reduce the wear and improve the durability of the mold and save the cost, the mold is easy to demould to increase the production rate, and the surface of the mold is bonded to the glass. The uniform distribution of the layer can increase the yield of the sub-modules produced by the mold. |
| priorityDate | 2013-06-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 35.