| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_81cfb88d909c75104c0c8d61799a72b0 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-0073
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02074
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-0042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02068
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23G1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23G1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D11-0041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D11-0047 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23G1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D3-43
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D3-33
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D3-30 |
| filingDate |
2014-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ab3545439a031be5541ae90ab654ff8e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_19ab3a0f5edd68ba5f9772bdf8d463da
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1fc5431801253dfcf7a8c6ee7b2da1a0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c8b977c5c53cfc5fdf2e10943e96f88
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_57b308a1dcc6dc160ca1ce8c409c0561
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2dc436f1e8b39257bf770556316eef9c |
| publicationDate |
2015-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201500542-A |
| titleOfInvention |
Copper cleaning and protection formula |
| abstract |
A cleaning composition and method for cleaning such residues and contaminants from a microelectronic device having chemical mechanical polishing (CMP) residues and contaminants thereon. The cleaning compositions include corrosion inhibitors and surfactants. The composition achieves a highly efficient cleaning of the post-CMP residue and contaminants from the surface of the microelectronic device without damaging the low-k dielectric material or the copper interconnect material. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9828574-B2 |
| priorityDate |
2013-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |