| abstract |
The curable composition for optical semiconductor encapsulation of the present invention is characterized by comprising the following components (A), (B), and (C), and the curable composition for optical semiconductor encapsulation of the present invention is characterized by: In addition to A), (B) and (C), the following component (D) is further included.nComponent (A): a compound having one or more functional groups selected from the group consisting of an epoxy group, an oxycyclobutane group, a vinyl ether group, and a (meth) acryl fluorenyl groupnIngredient (B): alicyclic epoxy compoundnComponent (C): a hardening catalyst which generates an acid by light or heat with an anion component having a cationic component of an aromatic ring and having a central element of boron or phosphorusnComponent (D): Conductive fiber-coated particles containing a particulate matter and a fibrous conductive substance covering the particulate matter |