| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9255994893bc559e4608e627388ba146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6a162b65402a9a79580e3ae31dcbf3fa |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0341
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-0016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-19
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-262
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C13-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-0008
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-008
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K31-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
| filingDate |
2014-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d3a51fbed3a7e6c8ac54ceeb48dfce5a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_79a2c689172b584bfc3922ac0985153c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_449866a745d3210123e0ae549e33cc70
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f14fc7c9e650a899f280c28518ea3647 |
| publicationDate |
2014-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201448699-A |
| titleOfInvention |
Wiring substrate and method of manufacturing same |
| abstract |
The present invention provides a wiring substrate comprising: an electrode including Cu or a Cu alloy; a plating film having a film containing at least Pd formed on the electrode; no Pd concentration layer between the electrodes and heat bonding on the plating film The Pd dissolved solder having a melting point of less than 140 ° C. |
| priorityDate |
2013-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |