| abstract |
The present invention provides a reinforcing sheet which can produce a secondary mounting semiconductor device excellent in impact resistance, and which can realize the efficiency of the secondary mounting step, and a manufacturing method of the secondary mounting semiconductor device using the same. The present invention is a reinforcing sheet for reinforcing a secondary mounting semiconductor device in which a primary semiconductor device in which a bump electrode is formed on a first main surface and is electrically connected to a wiring substrate via a bump electrode, and a substrate layer is provided in this order, In the adhesive layer and the thermosetting resin layer, the adhesive layer has a breaking strength of 0.07 MPa or more and a melt viscosity at 60 to 100 ° C of 4000 Pa‧s or less. |