http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201447493-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0385 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0048 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0388 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-062 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-075 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-028 |
filingDate | 2014-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eec6aa7e0a9ff8398d105ecd0592a6b7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e8ce14d57c22ac7419b44969604a6fb5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b1f080ffca83a23c94d07e5772dda9e0 |
publicationDate | 2014-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | TW-201447493-A |
titleOfInvention | Photocurable resin composition, dry film and cured product thereof, and printed wiring board having the hardened film formed using the same |
abstract | An object of the present invention is to provide a photocurable resin which is excellent in adhesion and flexibility to a substrate, has a low incidence of cracking or warpage of a cured product, and is excellent in resolution, and can be developed by an aqueous alkali solution. A composition, a photocurable dry film, a cured product, and a printed wiring board including the same. The solution of the present invention is to obtain a feature comprising (A) an alkali-soluble resin, (B) a photopolymerization initiator, (C) a ceria filler having an average particle diameter of 300 nm or less, and (D) YXY-type embedding. a photocurable resin composition which can be developed by an aqueous alkali solution, a photocurable dry film, a cured product, and a printed wiring board including the same, wherein the segment copolymer (Y and X are mutually different polymer units) . |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I761412-B |
priorityDate | 2013-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 422.