| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1653
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 |
| filingDate |
2014-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2a8c2a5152dd82804f8b0508725b0998
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9fc74b5d8dbcafb9728c1b894dbae322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_47510840d60e8c6f2a65ea18dd76d4c6 |
| publicationDate |
2014-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201447036-A |
| titleOfInvention |
Method of filling a through hole |
| abstract |
The method of the present invention suppresses or reduces pits and voids when copper is plated with a flash copper layer on a via hole such as a substrate of a printed circuit board. The via hole containing the disulfide acid solution is applied to the via hole of the substrate, and then the via hole is filled with copper using an acid copper plating bath containing an additive such as a brightener and a leveling agent. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111867269-A |
| priorityDate |
2013-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |