abstract |
The present invention provides a phenolic hydroxy compound, a phenol resin containing the same, a cured composition, a cured product thereof, a semiconductor sealing material, and a printed wiring board, which are excellent in heat resistance and flame retardancy in a cured product. The phenol resin of the present invention is characterized by comprising a dinuclear compound (X) represented by the following structural formula (I) and a trinuclear compound (Y) represented by the following structural formula (II) as essential Component, □ [wherein, j and k are each 1 or 2, and at least one of j and k is 2] □ [wherein, l, m, and n are each 1 or 2, and at least one of l, m, and n The number is 2]. |