| abstract |
The present invention provides a phenolic hydroxy compound, a phenol resin containing the same, a cured composition, a cured product thereof, a semiconductor sealing material, and a printed wiring board, which are excellent in heat resistance and flame retardancy in a cured product. The phenolic hydroxy compound of the present invention is characterized by comprising a molecular structure represented by the following general formula (I). □ [wherein, X is a structural moiety represented by the following structural formula (x1) or structural formula (x2). In the formula (x1) or the formula (x2), k is an integer of 1 to 3, m is 1 or 2, and Ar is a structural moiety represented by the following structural formula (Ar1). □ (wherein p is 1 or 2) When k or m is 2 or more, a plurality of Ars may be the same and may be different from each other. }] |