| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7a37d7a7385924dd55e29ac1e96d1492 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-538
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1157 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 |
| filingDate |
2014-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2f28ca0f72a88cff1709b6c404af8983
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d87d7b9ad64f60e219422dda68a53b90 |
| publicationDate |
2014-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201446492-A |
| titleOfInvention |
Surface treated copper foil and copper clad laminate obtained by using surface treated copper foil |
| abstract |
An object of the present invention is to provide a copper foil which has good adhesion to an insulating resin substrate as compared with a non-roughened copper foil and which has good etching performance equivalent to that of a non-roughened copper foil. In order to achieve the object, a surface-treated copper foil or the like is used, and the surface of the copper foil is roughened in a surface-treated copper foil, and a copper composite compound having a maximum length of 500 nm or less is formed on the surface of the copper foil. The acicular or plate-like fine concavities and convexities are roughened to roughen the surface. Further, the copper composite compound preferably has 50% to 99% of cuprous oxide, and the balance is composed of copper oxide and impurities. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I609780-B |
| priorityDate |
2013-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |