| abstract |
A method for laser processing a thin plate substrate (1), particularly a wafer or glass element, to divide the substrate into multiple parts, wherein the substrate (1) is processed with a laser (3) A beam of light (2a, 2b) is directed onto the substrate, characterized by an optical arrangement (6) positioned in the laser (3) ray path that will lead to the thunder on the optical arrangement (6) a beam (2a) on the output side of the optical arrangement beam forming a laser beam focal line (2b) extending along a direction of the beam, the substrate (1) being related to the laser beam focal line (2b) Positioning to generate an induced absorption in the substrate material inside the substrate (1) along an extension (2c) of the laser beam focal line (2b) visible in the direction of the beam, to achieve the substrate An effect of inducing crack formation is produced along the extension (2c) in the material. (Fig. 3a) |