| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20caa64b571ec98459ceca26e3dd4ecf |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31681
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5399
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0353
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L21-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L71-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-315
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-00 |
| filingDate |
2013-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dd86f4e2bee0164e8222c829db165510 |
| publicationDate |
2014-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201444909-A |
| titleOfInvention |
Low dielectric halogen-free resin composition and circuit board using the same |
| abstract |
The present invention provides a halogen-free resin composition comprising: (A) 100 parts by weight of a polyphenylene ether resin; (B) 10 to 50 parts by weight of a maleimide resin; (C) 5 to 100 parts by weight a polybutadiene copolymer; (D) 5 to 30 parts by weight of a cyanate resin; and (E) 15 to 150 parts by weight of a phosphazene compound. The present invention can be made into a semi-cured by including a specific composition component and ratio so as to achieve high glass transition temperature, low thermal expansion coefficient, low dielectric property, heat resistance, flame retardancy, and halogen-free circuit substrate characteristics. Film or resin film, which can be applied to metal laminates and printed circuit boards. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I725851-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10196502-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I740729-B |
| priorityDate |
2013-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |