| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-091 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-325
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-2041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0397 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F1-48 |
| filingDate |
2014-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e0ba7b215ff6ec205b4a61d9c5a69209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_24fc1b958be16a1abc66d8bdf424bf85 |
| publicationDate |
2014-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201443565-A |
| titleOfInvention |
Pattern forming method, electronic component and manufacturing method thereof |
| abstract |
An object of the present invention is to provide a pattern forming method for suppressing collapse or peeling of a pattern when forming a fine pattern having a high aspect ratio, a method of manufacturing an electronic component including the pattern forming method, and a method for manufacturing the same by the above-described manufacturing method Manufacturing of electronic components. The pattern forming method of the present invention includes the steps of: forming an adhesion-promoting layer forming step, forming an adhesion-promoting layer having a polymerizable group and having a transmittance of light having a wavelength of 193 nm of 80% or more on a substrate; and a resist film forming step; Coating the radiation sensitive resin composition on the adhesion support layer to form a resist film; exposing the resist film to an exposure step; and developing a step of performing the exposed resist film Develop to form a pattern. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108573854-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108573854-A |
| priorityDate |
2013-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |