abstract |
The present invention provides an underfill sheet which can satisfactorily cover the unevenness of the circuit surface of the semiconductor element, and can connect the terminal of the semiconductor element to the terminal of the object to be bonded well, thereby reducing outgas. The present invention relates to an underfill sheet having a viscosity of 1000 to 10000 Pa‧s at 150 ° C and 0.05 to 0.20 rpm, and a minimum viscosity of 100 Pa at 100 to 200 ° C and 0.3 to 0.7 rpm. More than ‧s |