| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fcc0b66123940d1b32783569ebfa2d45 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-108 |
| filingDate |
2014-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f77eba0c5db6899eaaf8c2c569ca8e6f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_32740714f45889c006c653c2b81b8322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_768eda2a2562f2f735e00971b2d425b3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3b369d78a4da0701f9329db7e5b1248a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3ce26b92aa1a74d4ec37df4e882360e2 |
| publicationDate |
2014-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201439374-A |
| titleOfInvention |
Metal film forming method, conductive ink, multilayer wiring substrate, semiconductor substrate, and capacitor unit of dynamic random access memory |
| abstract |
An object of the present invention is to provide a method of forming a metal film on the surface of a metal film which can be easily formed by a simple method for a surface of a substrate including a hole that is in contact with the hole. A method for forming a metal film, comprising the step of heating the substrate in a state in which a surface of the substrate including the hole is in contact with the hole and a conductive ink containing a metal salt and a reducing agent. |
| priorityDate |
2013-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |