| abstract |
The present invention provides a composition which exhibits excellent dielectric strength in a high frequency region of a frequency of 1 GHz or more in addition to excellent adhesion strength to a substrate material, specifically, a low dielectric constant (?) and a low region in a region of a frequency of 1 GHz or more. In addition to the dielectric tangent (tan δ), the shrinkage stress at the time of thermosetting is also small, and the resin composition which can be thermally cured at 180 ° C or lower; and the adhesive film and the cover film which are formed using the resin composition. The resin composition of the present invention contains (A) a vinyl compound represented by the following formula (1), and (B) a polystyrene-poly(ethylene-butylene) block copolymer having a styrene content of 15 to 35%. (C) Polystyrene-poly(ethylene-ethylene/propylene) block copolymer having a styrene content of 25 to 40%, (D) epoxy resin, (E) bismaleimide, (F) utilization An organic peroxide having a heat generation peak of 100 ° C or more and 180 ° C or less as measured by differential scanning calorimetry (DSC), and the mass ratio of each component is (A+E)/(B+C)=0.81 or more and 1.00 or less, (B) / (C) = 1.00 or more and 4.00 or less, and the component (D) is contained in an amount of 1 to 10% by mass based on the mass percentage of the total mass of the components (A) to (F). (A) The mass percentage of the component content, containing 0.1 to 10% by mass of the aforementioned component (F), □ |