abstract |
The present invention provides a thermosetting resin composition which is excellent in low warpage property, cold and heat cycle characteristics, and the like, and which can suppress the occurrence of coating film cracking in a B-stage state, a cured product thereof, and a printed circuit board using the same. . The thermosetting resin composition of the present invention is characterized by comprising (A) an epoxy resin, (B) a curing agent for an epoxy resin, (C) spherical ceria and/or spherical alumina, and (D) Block copolymer. |