| abstract |
The present invention provides a method of forming a substrate for a semiconductor package and a substrate for a semiconductor package. The method includes providing a carrier and forming a plurality of outer pads on the carrier, the outer pads formed on the carrier defining a first conductive layer. A molding operation is performed to form a first insulating layer on the carrier with a molding compound. The first conductive layer is buried in the first insulating layer. Forming one or more of a plurality of bond pads, a plurality of conductive traces, and a plurality of microvias on the first conductive layer, and forming the bond pads, the conductive traces, and the like on the first conductive layer The one or more of the microvias define a second conductive layer. |