| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38ed56a4b4e8e2315b2b3308bffedb3f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0118
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0264
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0235
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0242
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-025 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01C19-5769
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01C19-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B3-0021
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P15-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P15-125
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L9-0044
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P15-0802
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L19-0092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L19-0076
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00134
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00309
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00293 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-58 |
| filingDate |
2014-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fc5b578d743810adf3ab40cd255f96e4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_16324cd6d036e417c1396242228171af |
| publicationDate |
2014-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201436068-A |
| titleOfInvention |
Microelectromechanical device and method of forming same |
| abstract |
One method embodiment of the present invention includes providing a MEMS wafer including a polysilicon layer having a first portion and a second portion. A carrier wafer is bonded to the first surface of the MEMS wafer, and bonding the carrier wafer produces a first cavity. The first surface of the first portion of the polysilicon layer is in contact with ambient pressure. A cap wafer is bonded to the second surface of the MEMS wafer, and the cap wafer is bonded to the first surface of the MEMS wafer to produce a second cavity including a second portion of the polysilicon layer and a The third cavity. The second surface of the first portion of the polysilicon layer is in contact with the pressure level of the third cavity. The first cavity or the third cavity is in contact with the surrounding environment. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11276587-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10049901-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9576827-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10504756-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9754813-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9490158-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9837291-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I611569-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I660439-B |
| priorityDate |
2013-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |