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publicationDate 2014-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201435147-A
titleOfInvention Sn alloy plating device and method
abstract The Sn alloy plating apparatus includes an anion exchange membrane that partitions the inside of the plating tank into a cathode chamber and an anode chamber, wherein the cathode chamber is provided by holding a Sn alloy plating solution and immersing the substrate in the Sn alloy plating solution. And the anode chamber is an anolyte that retains an acid containing Sn ions and a complex with a divalent Sn ion, and is disposed by immersing the Sn anode in the anolyte; and an electrolyte supply line, the electrolyte containing the acid is directed toward The anode supply; the electrolyte supply line is such that the concentration of the Sn ion in the anode chamber is equal to or greater than a predetermined value and the concentration of the acid is not lower than the allowable value, and the electrolyte is supplied to the anode chamber, and the electrolysis is accompanied. The anolyte in the anode chamber which is supplied by the supply of the liquid is supplied to the Sn alloy plating solution.
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