| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_74973199515dbabd2310245aab03e282 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0652
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-082 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-00 |
| filingDate |
2013-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e819092d92eab3eb2382e477d7510904
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f28db0aa51a07de45cba23027fbdfcb5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_87b5cd9027bcbe474358ec33b529b937
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5d70b9f29864a675149b7cb5726005e5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ccf948c94d16a43b33d1670049f7c0c2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_216b97453fd84e4fd125a3115af7e6f3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3d2bbef27afe8289599584fb50d827ad
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf5a1bae04ccab091a5a4ac410213d27
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_35126cde46c9fd6bdec82932435639f3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f0a99c0af913b04ffb6ec7dc88258679 |
| publicationDate |
2014-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201433394-A |
| titleOfInvention |
Processing device and processing method |
| abstract |
The present invention provides a processing apparatus and a processing method capable of performing processing with higher precision with a simple configuration. The processing apparatus includes an irradiation head 16 and a control device. The irradiation head 16 includes a laser rotating portion 35 and a collecting optical system 37. The laser rotating portion 35 includes a first weir 51, a second weir 52, and a first rotating mechanism 53. And the second rotating mechanism 54. The control device adjusts the difference between the number of revolutions of the first turn 51 and the second turn 52 and the phase angle based on at least the relationship between the heat affected layer of the workpiece and the number of revolutions of the laser. |
| priorityDate |
2013-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |