| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4d9d138d23c7ca8bfae3daf28b4eba0 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2255-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2255-10 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C48-21
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-308
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-365
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C51-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C51-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C51-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B33-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00 |
| filingDate |
2013-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_356b38c6ecd8613519734c81157c6c18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_30cb39147812ca771f6684def4a7d054
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_572dd2049c4a757206ddd9978037c64b |
| publicationDate |
2014-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201431683-A |
| titleOfInvention |
Forming resin laminate and molded body |
| abstract |
The present invention provides a molded resin laminate having excellent surface hardness and thermoformability, and a molded article obtained by subjecting the molding resin laminate to thermoforming. The molding resin layering system in which the resin layer A formed of the thermoplastic resin composition a and the resin layer B formed of the curable resin composition b are laminated at least in two layers; wherein the resin The pencil hardness of the surface of the layer B is 5H or more, and the storage elastic modulus of the resin layer A and the resin layer B at the glass transition temperature of the resin layer A at -20 ° C is -2.0 (GPa) ≦ resin layer B The storage elastic modulus-resin elastic layer A of the resin layer A is ≦2.5 (GPa), or the elongation of the molding resin laminate at a temperature of -30 ° C of the resin layer A is 6%. Above and below 50%. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I784046-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112839787-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112839787-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11701803-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111051063-A |
| priorityDate |
2012-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |