| abstract |
An object of the present invention is to provide a release film which is excellent in release property, particularly in adhesion to an epoxy resin-based adhesive, and which has heat resistance and does not need to be coated with a polyfluorene-based release agent. A release film, and a method for producing a printed wiring board using the release film, the release film comprising polybutylene terephthalate (A), and characterized in that the release film comprises The amount of oligomer is 2,500 ppm or less. |