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filingDate 2014-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f461be365b946f5c2caac155b9270e12
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publicationDate 2014-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201431132-A
titleOfInvention Light-emitting diode device
abstract The invention discloses a package structure of a light-emitting component, comprising a circuit carrier having a platform; a light-emitting component having a transparent substrate, the transparent substrate comprising a first plane and a second plane; and a light-emitting diode die is transparent a first plane of the substrate; and a first transparent adhesive material located in the first plane and covering the light emitting diode die; wherein the angle between the first plane and the platform is not equal to 0 degrees, and the first transparent adhesive material is in the first plane The projection is circular and the light-emitting diode dies are located at the geometric center of this circular projection.
priorityDate 2013-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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