| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_581f284ded78643ba826989e49935c87 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-425
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-426
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4864
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32134
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31133 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23G1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-44 |
| filingDate |
2013-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_39788fc6cb57160048b1e5a6d645e635
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8f101a638e89a76ac037d8fb2f8ecd08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_627c5ed21cb06e8d8eab4e1efd08a366
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5fb449267d55eb7eaa344b1053e09fa8 |
| publicationDate |
2014-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201430173-A |
| titleOfInvention |
Method of etching metal |
| abstract |
The present invention illustrates a method of etching a metal. In an embodiment, the method can include contacting the substrate with a stripping solution to remove the photoresist from the substrate to produce a stripped substrate. The stripped substrate can include a plurality of solder columns and a plurality of metal-containing field regions disposed about the plurality of solder pillars. In an illustrative embodiment, the plurality of field regions may comprise copper. Additionally, the method can include cleaning the stripped substrate to produce a cleaned substrate. The cleaned substrate may be substantially free of a Sn layer or a Sn oxide layer. Additionally, the method can include contacting the cleaned substrate with an etching solution that is capable of removing a quantity of one or more metals from the plurality of field regions. |
| priorityDate |
2012-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |