http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201429962-A

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filingDate 2013-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_90093a36e17cfa69fec7eeec1af3d1ea
publicationDate 2014-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201429962-A
titleOfInvention Epoxy compound, method for producing the same, and curable epoxy resin composition
abstract An object of the present invention is to provide a novel epoxy compound which can form a cured product having high heat resistance. The epoxy compound of the present invention is a compound represented by the following formula (1), and in the formula (1), X1 and X2 are the same or different, and represent an alkyl group, an oxygen atom, a sulfur atom, or a non- Bonding. R represents a divalent group having one or more atoms. R1 to R8 are the same or different and each represents a hydrogen atom, an alkenyl group which may have a substituent, an epoxidized alkenyl group which may have a substituent, or an alkyl group which may have a substituent. Y1 and Y2 are the same or different, and represent a divalent group represented by the following formula (a) or a divalent group represented by the following formula (b), wherein R1 to R12 of the formula (1) At least one of them may be an alkenyl group which may have a substituent, an epoxidized alkenyl group which may have a substituent, or an alkyl group which may have a substituent. Further, when Y1 and Y2 in the formula (1) are simultaneously a divalent group represented by the formula (a), at least one of R1 to R10 is an optionally substituted epoxidized alkenyl group].
priorityDate 2012-11-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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