http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201428357-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2400-02 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D133-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D133-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04N23-55 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B1-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14618 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14623 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14625 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B5-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B5-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B5-208 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B5-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02B5-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04N5-225 |
| filingDate | 2013-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_881a80009d01d6e88b3952fd5db31a52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f7819d9f367b84858d4460c06df6db8f |
| publicationDate | 2014-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201428357-A |
| titleOfInvention | Infrared cut filter, manufacturing method thereof, solid-state imaging device, and method for forming light-shielding film |
| abstract | The present invention provides an infrared cut filter that suppresses glare or ghost generation. The solid-state imaging device includes a complementary metal oxide semiconductor sensor, a circuit board, a ceramic substrate, an infrared cut filter, a photographing lens, a lens holder, and a holding cylinder. The complementary metal oxide semiconductor sensor is packaged on the circuit substrate. The circuit substrate is fixed to the ceramic substrate in a state in which the complementary metal oxide semiconductor sensor enters the opening of the ceramic substrate, and the side surface of the complementary metal oxide semiconductor sensor is covered by the ceramic substrate. The infrared cut filter is fixed to the ceramic substrate in such a manner as to cover the opening. A complementary metal oxide semiconductor sensor is disposed behind the photographing lens, and an infrared cut filter is disposed between the photographing lens and the complementary metal oxide semiconductor sensor. A light shielding layer is formed on the end of the incident surface of the infrared cut filter over the entire circumference. Harmful light such as reflected light is shielded by the light shielding layer. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I667494-B |
| priorityDate | 2012-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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