| abstract |
The present invention provides a non-cyanide electroless gold plating solution which forms a plating film capable of maintaining high hardness even when heat treatment is performed. The non-cyanide electrolytic gold plating solution of the present invention contains a gold source containing a gold sulfite base salt or a gold ammonium sulfite, and a conductive salt containing a sulfite and a sulfate salt, and the ruthenium, osmium and bismuth contained therein The metal concentration of one or more salts of one is 1 to 3000 mg/L. At the same time, it is preferred to include a crystal modifier, especially ruthenium. |