| abstract |
A copper film forming composition capable of easily forming a low-resistance copper film, a copper film forming method using a copper film forming composition, and a copper film, a wiring board, and a touch panel are provided. And (A) at least one copper compound selected from the group consisting of copper organic acid, copper hydroxide and copper oxide, (B) a halogen compound, and (C) a reducing agent to prepare a copper film for forming A composition for forming a copper film. A composition for forming a copper film is used to form a coating film on a substrate, and heating is performed at 200 ° C or lower to form a copper film on the substrate to produce a wiring substrate. In addition, a coating film is formed on the transparent substrate (22) such as the first detecting electrode (23) and the second detecting electrode (24), and the coating film is heated to form the lead wiring (31). ) to manufacture the touch panel (21). |