| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_beb404f9a250feec96df3e0bce4961d6 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-085
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2305-076
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L25-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31529
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G14-06 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0353 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L25-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-12 |
| filingDate |
2013-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_268fb0ef10a7e3f5345c0802553b0ea1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b743dfca71cff3ee0c0f12b152abe2df
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_252669181ba0e16ad8e4b7b995a2471c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb9de61937c7b158a9bcb2bb745877a9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ad210a32987a84380153477b057b8b2d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4e25d2ba81d0c43ce7869c02c1133169 |
| publicationDate |
2014-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201425447-A |
| titleOfInvention |
Low dielectric resin composition and copper foil substrate and printed circuit board using same |
| abstract |
The present invention provides a halogen-free resin composition comprising: (A) 100 parts by weight of a naphthalene type epoxy resin; (B) 10 to 100 parts by weight of a styrene maleic anhydride copolymer; and (C) 30 to 70 parts by weight of a bisphenol F phenolic resin containing a DOPO functional group. The present invention can achieve a low dielectric constant, a low dielectric loss, a high heat resistance and a high flame resistance by including a specific composition and ratio; it can be made into a semi-cured film or a resin film, thereby achieving application. The purpose of the copper foil substrate and printed circuit board. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110527248-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I631182-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I639652-B |
| priorityDate |
2012-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |